Mobio Corporation is an Equal Employment Opportunity employer,
offering competitive compensation/benefits/options and a challenging
work environment. Presently we have the engineering staff
as well as management positions open in Palo Alto, USA, Tokyo,
Japan, or Hsinchu, Taiwan. Micro Mobio welcomes anyone who
is qualified and interested in the highly exciting field of
wireless communication to apply.
Design and characterization of RF IC & PA.
BSEE / MSEE /PhD with 3+ year experience on RF IC &
PA CAD design, simulation and characterization using microwave
testing equipments. Computer skills and experience in compound
semiconductors are preferred. Experience in development
of cellular phones is a definite plus.
Automatic testing in production of RF IC circuits.
BSEE / MSEE with 3+ year experience on RF/microwave and
automatic testing for high volume production. Computer programming
skills such as in C++ are preferred.
Product Manager/ Sr. Engineer
Responsible for contract manufacturing, mass production
scheduling and yield improvement.
BS degree or higher with 5+ year experience in production
and related fields. Knowledge of wireless circuit and IC
packaging is necessary.
Work with sales team to provide technical assistance to
customers. Design and implement application circuit.
BS degree with 3+ years of experience in PCB design &
layout, RF circuit simulation and RF circuit testing.
Responsible for key accounts. Support technical sales activities
in Asia or North America. Coordinate customer technical
support with Applications Engineers.
BSEE degree or equivalent with 3+ years experience in sales
activity. Familiar with sales in wireless fields. Excellent
in communication and highly motivated.
are interested in any of the above positions, please send
your resume to email@example.com
by e-mail, or to (650) 565-8761 in USA, or (03) 525-8242 in
Taiwan by fax.